Optical sensor with optical interconnection board

ABSTRACT

An optical sensor comprises a sensor circuit having parts which are optically interconnected with each other through an optical interconnection board interposed therebetween. The interconnection between the sensor circuit parts is thereby simplified remarkably, so that the mass-producibility of the sensor can be increased to lower its manufacturing costs.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to optical sensors having a sensor circuit withparts thereof interconnected through an optical interconnection system.

The optical sensors of the kind referred to should have enhanced utilitywhen employed for detecting an object present within a detection area.

2. Description of the Prior Art

The use of optical interconnection between respective sensor circuitparts with an optical interconnection system utilized has been discussedby J. A. Neff in his article titled "Optical Interconnections BetweenIntegrated Circuit Chips" in "Hybrid Circuits" No. 10, May 1986, pages68-71, in which the circuit chips are interconnected through opticalfibers, instead of by conventional conductor connection employingconductor foils and the like.

While in this case the technique of optical fiber connection of Neff maybe one of basic technologies for the optical interconnection system,there still has been suggested no practical measure that can be employedon a commercial scale in, for example, required interconnectionarrangement for the optical sensors and the like. Accordingly, there isa need for an optical interconnection system which can be produced at alow cost.

3. Summary of the Invention

A primary object of the present invention is, therefore, to provide anoptical sensor in which the optical interconnection arrangement isutilized for simpler interconnections between the respective sensorcircuit parts, so that the mass-producibility of the sensor can beincreased to lower its manufacturing costs.

According to the present invention, the above object can be attained byproviding an optical sensor in which light is projected from a lightprojecting means through a sensor function setting section to adetecting area, a reflected light from an object within the detectingarea is received by a light receiving means, and the presence or absenceof the object is discriminated at a signal processing means by operatingoutputs from the light receiving means, the signal processing meansproviding an object detection signal, wherein the light projectingmeans, light receiving means and signal processing means are opticallyinterconnected through an optical interconnection board.

In the optical sensor of the above arrangement according to the presentinvention, respective parts of sensor circuit can be interconnected bythe optical interconnection board in a simpler manner, whereby requiredelectric connection between the respective circuit parts can beremarkably simplified, the sensor can be remarkably improved in itsproducibility, and it is made possible to realize the mass-producibilityof the sensor and thus at a lower cost.

Other objects and advantages of the present invention will be made clearin following description of the invention with reference to embodimentsshown in accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the optical sensor according to thepresent invention in an embodiment thereof, with a portion shown asdisassembled;

FIG. 2 is a perspective view as disassembled of the optical sensor shownin FIG. 1 in a slightly reduced scale;

FIG. 3 is a side view of the optical sensor of FIG. 1 in a slightlyenlarged scale;

FIGS. 4, 5, 6, and 7, are fragmentary sectioned views for showing arelationship between an optical interconnection board and a printedcircuit substrate in the optical sensor of FIG. 1 at their differentpositions;

FIG. 8 shows in a plan view a disk member provided with respect to anend of an optical wave guide in the optical sensor of FIG. 1;

FIGS. 9 and 10 are fragmentary schematic views for explaining a modesetting knob shown in another embodiment than that of FIG. 1 andapplicable to the optical sensor of the present invention;

FIG. 11 shows in a block diagram another embodiment of the opticalsensor according to the present invention;

FIG. 12 shows in a perspective view a light receiving side of theoptical sensor of FIG. 11;

FIG. 13 is a side elevation on the same light receiving side of theoptical sensor of FIG. 11;

FIG. 14 is a perspective view on the light projecting side of theoptical sensor of FIG. 11;

FIG. 15 is a perspective view in another aspect of the light projectingside applicable to the sensor of FIG. 11;

FIG. 16 shows in a schematic sectioned view still another embodiment ofthe optical sensor according to the present invention;

FIG. 17 is a perspective view of a further embodiment of the opticalsensor according to the present invention, with a portion shown asdisassembled;

FIG. 18 shows in a schematic side view the optical sensor of FIG. 17;

FIGS. 19(a), 19(b), 19(c), 19(d), 19(e), 19(f), 19(g), and 19(h) arefragmentary diagrams for explaining respective aspects of the opticalinterconnection in the optical sensor of FIG. 17;

FIGS. 19(i), 19(j), 19(k), and 19(l) show another embodiment of theoptical sensor according to the present invention, in which FIG. 19(i)is a fragmentary side view thereof, FIG. 19(j) is a schematic diagramshowing a light amount adjusting means employed in the sensor of FIG.19(i), FIG. 19(k) shows in a perspective view a light shielding knob inthe adjusting means of FIG. 19(j), and FIG. 19(l) shows also in aperspective view another aspect of the light shielding knob;

FIG. 20 is a schematic side view of a further embodiment of the opticalsensor according to the present invention;

FIG. 21 is a fragmentary perspective view of an optical volume mechanismapplied to the optical sensor of the present invention;

FIGS. 22, 23, and 24 are explanatory views of the volume mechanism ofFIG. 21;

FIG. 25 is a diagram showing the relationship between cam's rotary angleand controlled light amount in the volume mechanism of FIG. 21;

FIG. 26 is a fragmentary perspective view of another embodiment of theoptical volume mechanism applicable to the optical sensor of the presentinvention;

FIGS. 27, 28, and 29 are explanatory views for the operation of theoptical volume mechanism of FIG. 26;

FIG. 30 is an explanatory diagram in still another embodiment employingan anamorphic lens of the optical sensor according to the presentinvention;

FIGS. 31, 32, and 33 are explanatory views for the operation of theoptical sensor of FIG. 30;

FIGS. 34, 35, and 36 are explanatory views for further embodiments ofthe optical sensor according to the present invention in respectivewhich the anamorphic lens is employed; and

FIGS. 37, 38, and 39 are explanatory views for the operation of theoptical sensor of FIG. 34.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring here to FIGS. 1 to 3, there is shown as an embodimentaccording to the present invention a reflection type optical sensor 10,which comprises a printed circuit substrate 11 carrying on one sidelight projecting and receiving elements and on the other side an opticalinterconnection board 12. The printed circuit substrate 11 comprisespreferably such an electrically insulative substrate as a ceramic, glassor the like plate and a conductor circuit pattern formed on a surface ofthe substrate, and such electronic circuit parts 13 as chips including,for example, transistors, capacitors, resistors and the like are mountedonto the conductor pattern. A light emitting element 14 such as a lightemitting diode which forms a light projecting means as well as anoperation indicating light emitting element 15 which also functions as areference light generator are mounted to an auxiliary printed circuitsubstrate 16 which is mounted to the printed circuit substrate 11. Afirst light receiving element 17 and a second group of light receivingelements 18-20 which form a light receiving means for the reflectionlight from any object present in the detecting area are made into one ICchip 21, and this IC 21 is also mounted to the printed circuit substrate11.

In the present instance, the printed circuit substrate 11 is made tohave through holes 22-27 at positions corresponding to the lightemitting elements 14 and 15 as well as to the light receiving elements17 and 18-20 on the one side of the substrate 11 so that these lightemitting and receiving elements and electronic circuit parts can beoptically interconnected through these through holes 22-27 with theoptical interconnection board 12, while these holes function also aspositioning means for mounting the former elements and parts to thesubstrate 11. In an event where the printed circuit substrate 11 is madeof a transparent material of a low light attenuation such as atransparent ceramic, transparent glass or the like, it is not alwaysnecessary to provide the through holes in the substrate.

The optical wiring board 12 comprises, on the other hand, optical waveguides 28-34, input and output mirror portions 35-40, light projectinglens portion 41 and light receiving lens portion 42. In this case, theoptical wiring board 12 may be mass-produced and thus made at a lowercost with employment of any precision resin molding technique orintegrated circuit formation technique based on a photographic maskingoperation which is well known to one skilled in the art. In forming thewiring board 12, a photo-setting resin is preferably employed so thatthe optical wave guides 28-33 can be effectively prepared by means ofpatterning with a photographic masking exposure. It is also possible toemploy a glass plate as the basic member for the optical wiring board 12in which the optical wave guides 28-34 can be formed with a material ofa high refractive index diffused into the glass at predeterminedportions of the glass plate, or with any proper manner of preparation ofthe optical wave guide other than the above as occasion demands. At endportions of the optical wave guides 29-31 branching off from the guide28, there is disposed a sensor function operating section comprising anoperation indicating member 43, output mode setting member 44 andsensitivity setting member 45, in proximity to the end portions.

In the optical wiring board 12 as in the above, a light Po emitted fromthe light emitting element 15 is provided as an input to the opticalwave guide 28 through the input mirror portion 35 as seen in FIG. 4, andthe light P₀ is divided at a predetermined ratio to the respectiveoptical wave guides 29-32 to propagate therethrough, as shown in FIG. 3.First branch light P₁ in the wave guide 29 is directed to a light inputsurface 46 of the operation indicating member 43 of a light diffusionblock type at the end portion of the guide 29, the light thus reachingthe member 43 being caused to be scattered in all radial directions sothat it can be visually determined that the optical sensor 10 is in anoperating state. Second branch light P₂ is directed to the output modesetting member 44 disposed at the end portion of the optical wave guide30. This output mode setting member 44 comprises a shiftable flat platepart 47 and an operating part 48 secured onto the flat part 47, and thisflat plate part 47 is formed so as to be non-reflective only at a partof a surface of the plate part 47 facing the end portion of the waveguide 30 while the rest of the surface of the plate part is formed so asto be reflective, so that the reflection factor at the output modesetting member 44 can be varied by having the member 44 slid to displacethe non-reflective surface part with respect to the opposing end portionof the wave guide 30, whereby the branch light P₂ is modified inresponse to the amount of displacement of the output mode setting member44. An optical wave guide 33 is provided with one end thereof opposed tothe setting member 44 so as to be jointly disposed with the branch waveguide 30 in the thickness direction of the wiring board 12 and other endthereof extends away therefrom, as seen best in FIG. 1, to a sidewarddirection so as to terminate at a mirror portion 36. Accordingly amodulated light P₂ ' responsive to the set position of the settingmember 44 is directed through the wave guide 33, the modified lightbeing reflected at the mirror portion 36 and received by the lightreceiving element 19 opposing the other end of the wave guide 33, asseen best in FIG. 6.

Third branch light P₃ is directed through the optical wave guide 31 toan optical input part of the sensitivity setting member 45 disposed atan end portion of the optical wave guide 31. This member 45 comprises asensitivity setting knob 52 provided with a disk part 50 perforated tohave many small holes 49 of a predetermined distribution of varyingdensity as seen in FIG. 8 and with an operating part 51, and areflection plate 53 opposed to the end portion of the wave guide 31 withthe disk part 50 interposed therebetween. The small holes 49 in the diskpart 50 are distributed in the present instance to gradually increase ordecrease in the circumferential direction, so that the reflection factorof the reflection plate 53 with respect to the third branch light P₃which has passed through the small holes 49 of the disk part 50 will bevaried depending on the amount of rotation or angular position of thesensitivity setting knob 52. An optical wave guide 34 is provided withone end thereof opposed to the member 45 as to be jointly disposed withthe branch wave guide 31 passing the third branch light P₃ in thethickness direction of the wiring board 12 and the other end thereofextends away therefrom also in the sideward direction to terminate at amirror portion 37. Accordingly a modulated light P₃ ' responsive to theangular position of the sensitivity setting member 45 will propagatethrough the optical wave guide 34 to be reflected at the mirror portion37 and be received by the light receiving element 18 opposing the otherend of the wave guide 34, as seen in FIG. 5.

Fourth branch light P₄ propagates through the optical wave guide 32 tobe reflected by the mirror portion 38 at an end portion thereof and bereceived by the light receiving element 20 opposing this wave guide 32.

Instead of such provision of the output mode setting member 44 as in theabove, it may be possible to provide an output mode setting member 44awhich is provided with a stepped portion as shown in FIGS. 9 and 10, sothat the member 44a will have different distances d₁ and d₂ to the endportion of the wave guide 30 depending on the displaced position of themember 44a, the distance d₁ being relatively larger as seen in FIG. 9 torender the modulation level to be lower while the distance d₂ beingrelatively smaller as in FIG. 10 to elevate the modulation level. Thedisk part 50 of the sensitivity setting member 45 may have a shape otherthan a true circle such as a non-circular configuration that will forman involute curve so that opposing area between the disk part 50 and theend portion of the wave guide 31 or 34 will be varied as the settingmember 45 is rotated, whereby the sensitivity variation can be realizedwithout perforating the disk part.

A light from the light emitting element 14, on the other hand, isreflected on the mirror portion 39 so as to be collimated at the lightprojecting lens part 41 and irradiated out of the wiring board 12 as alight beam. Any reflected light of the beam back from any object presentin a detection area is condensed at the light receiving lens portion 42and is reflected at the mirror portion 40 so as to be incident upon thelight receiving element 17 as seen in FIG. 7.

An assembling operation for making the optical sensor 10 in theforegoing embodiment shall be briefly referred to. First, the electroniccircuit parts 13 such as the transistors, capacitors, resistors and thelike, the auxiliary printed circuit board 16 including the lightemitting elements 14 and 15 and the IC chip 20 of the light receivingelements 17 and 18-20 are mounted to a front side surface having theconductor pattern of the printed circuit substrate 11. Onto the otherreverse surface of the substrate, the optical interconnection board 12including the optical wave guides 28-34, mirror portions 35-40 and lensportions 41 and 42 are mounted while being positioned by means of thethrough holes 22 to 27, and the substrate 11 is inserted into a casing(not shown) in which the indicating member 43, output mode settingmember 44 and sensitivity setting member 45 are disposed for theforegoing operations thereof and the board 12 is secured in the casing.With this arrangement, it is made possible that the light emittingelements 14 and 15 coupled to the electronic circuit parts 13 throughthe optical wave guides 28-34, mirror portions 35-40 and through holes,are optically interconnected with the light receiving elements 17 and18-20. According to this interconnection arrangement, the componentparts of the sensor can be assembled only through the positioning stepsfor the optical coupling, without involving any electric, mechanical andeven optical connecting steps, whereby the required number of parts canbe reduced to a large extent, the sensor can be remarkably improved withrespect to ease of assembling a sufficient reduction of required costscan be well achieved and the arrangement even contributes to aminimization in size of the sensor.

In the optical sensor 10 of the foregoing arrangement, further, itshould be readily appreciated that the object in the detecting area canbe detected in accordance with the received light output of the lightreceiving element 17, the detection can be modified in the mode byproperly processing at a signal processor the output signal of the lightreceiving element 19 which receives light through the optical wave guide33 for the modulated light P₂ ', mirror portion 36 and hole 26, and aproper sensitivity setting voltage can be generated through a comparisonof the output from the light receiving element 18 which receives lightthrough the wave guide 34 for the modulated light P₃ ', mirror portion37 and hole 25 with the output of the light receiving element 20 whichreceives light through the wave guide 32 for the branch light P4, mirrorportion 38 and hole 27.

Referring next to FIGS. 11 to 14, there is shown another embodiment ofthe optical sensor according to the present invention, in whichsubstantially the same members as those in the foregoing embodiment areshown with the same reference numerals increased by 100. In the presentembodiment, a light projecting means 100 and a light receiving means 102connected to a signal processing means S.P.M. 101 are disposed so as tooppose each other. In the present embodiment, in contrast to theforegoing embodiment of FIGS. 1-10, the light projecting means 100 isprovided as separated from the light receiving means 102 and, except forthe removal of a light projecting system, the light receiving means 102is substantially of the same arrangement as that in the foregoingoptical sensor 10. The light projecting means 100 comprises, on theother hand, a printed circuit substrate 111a to which light emittingelements 114 and 115 and IC chip 116 are mounted, and an opticalinterconnection board 112a including a light projecting lens 141 andoptical wave guide 128a, the board 112a being attached to the substrate111a, so that a light projection from the light emitting element 115will propagate through the wave guide 128a to be incident upon anoperation indicating member 143. The light projected from the lightemitting element 114 in the light projecting means 100 is irradiatedthrough the light projecting lens 141 towards the opposing lightreceiving means 102, the presence of an object OJ between both means 100and 102 is thereby detected, and an energizing state of the lightprojecting means 100 is indicated with the operation indicating member143. It is also possible to have, as shown in FIG. 15, a light receivingmeans 100b provided only with a single light emitting element 114b forlight projection by this element 114b, so that the projected light ofthe element 114b will propagate through an optical wave guide 128bformed so as to extend between the light emitting element 114b and theoperation indicating member 143b, for realizing the operation indicationfunction of the member 143b.

According to another feature of the present invention, the circuitforming members and optical interconnection board are mounted onto thesame side of the printed circuit substrate, specifically onto the sidehaving the conductor pattern, in contrast to the foregoing embodimentsin which the circuit forming members are mounted to one side while theoptical interconnection board is mounted to the other side of thesubstrate. Referring to FIG. 16, for example, a printed circuitsubstrate 211 carries on one side having the conductor patternrespective electronic circuit parts 213, and an IC chip 221 includingtherein an array of light receiving elements as well as a light emittingelement 215 are mounted on the same side of the substrate. In additionto a light receiving lens 242, an optical interconnection board 212including mirror portions 235 and 236 secured through a spacer 216 tothe board is also provided on the same side of the substrate 211. Asrequired, an optimum throttle 245 may be disposed between the lightemitting elements and the mirror portions. In the present embodiment ofFIG. 16, the respective components referred to are formed so as to beslightly different from corresponding components of the foregoingembodiments of FIGS. 1 to 10 or FIGS. 11 to 15, but it should of coursebe possible to dispose similar components to those of the foregoingembodiments concentrated on one side of the printed circuit substratefor achievement of substantially the same operation. According to thepresent embodiment, as will be readily appreciated, there can beattained a further improvement particularly in the ease of the assemblyoperation.

According to still another feature of the present invention, thebranched wave guides in the optical interconnection board arediscontinuous, and means for adjusting the amount of light propagatingthrough the optical wave guides is provided in a space where the waveguides are discontinuous. Referring now to FIGS. 17 and 18, there areformed in an optical interconnection board 312 of a further embodiment apair of indicating optical wave guides 329a and 329b for propagation ofemitted light from light emitting elements 315a and 315b, branchingoptical wave guides 331a to 331d for divided propagation of an emittedlight from a light emitting element 315c, and a pair of optical waveguides 332a and 332b for propagation initially through the guide 332a oflight from a light emitting element 314 and then through the guide 332bafter the light from the element 314 is reflected back from a mirrorportion 335, the reflected light being further propagated as a referencelight to one 331d of the branching wave guides. A recess 328 is formedin the optical interconnection board 312 so as to separate intermediateparts of the branching optical wave guides 331a to 331d , and opposingside faces of the recess 328 are formed so as to be bulged (convex) atportions opposing respective free ends of the branching wave guides 331ato 331d, so as to form collimating lenses 355a-355d and on one side ofthe recess and condensing lenses 356a-356d on the other side of therecess 328 for rendering the light propagated through the wave guides331a-331d to be substantially parallel light beams in the recess 328. Alight intensity varying member 345 is disposed in the recess 328, andthis member 345 comprises a pair of light shielding elliptical disks357a and 357b which are secured eccentrically to a rotary shaft toproject therefrom in opposite directions so that, as the member 345 isinserted in the recess 328, the disks 357a and 357b will oppose twocentrally positioned ones 331b and 331c of the branching optical wavesguides 331a-331d and, as the member is rotated about the axis of theshaft, the amount of light propagating through the two optical waveguides 331b and 331c will be caused to vary by the eccentricity of thedisks 357a and 357b.

A notch 358 is further made in an upper side of the board 312 so as toagain cut off another part of one 331a of the branching optical waveguides, and an output mode setting member 344 is inserted in the notch358 so as to be shiftable therein, while operation indicating members343a and 343b are disposed so as to oppose respective free ends of theindicating optical wave guides 329a and 329b. Light projecting lens 341and light receiving lens 342 of the same structure as in the foregoingembodiments are provided on the substrate 311, and an IC chip 321including light receiving elements 317, 318, 319a, 319b and 320 and ofthe same arrangement as in the foregoing embodiments except for anadjustment in number to correspond to the number of the branching waveguides is also mounted to the substrate 311.

In the present embodiment, the presence of an object in the detectionarea causes a signal processing circuit to be actuated to energize theoperation-indicating light emitting element 315a for propagation oflight therefrom to the operation indicating member 343a which is therebyoperated to indicate the detection, whereas an energization of the lightemitting element 315b upon approach of the object to the detection areacauses the other operation indicating member 343b to be actuated toindicate the approaching object. By shifting the output mode settingmember 344 within the notch 358, on the other hand, the amount of lightin the first optical wave guide 331a in which the light from the lightemitting element 315c performs substantially the same action as theelement 15 in the FIGS. 1-10 embodiment is made to vary, and thedetection mode can be changed over. With a rotary displacement of thelight intensity varying member 345 in the recess 328, the amount oflight propagated from the light emitting element 315c to the twobranching optical wave guides 331b and 331c can be varied, and the sameadjusting operation as in the foregoing optical sensor 10 for theoptical wave guide can be realized with respect to a plurality of thewave guides 331b and 331c. The provision of the optical wave guides 332aand 332b as associated with the light emitting element 314 and with thebranching optical wave guide 331d makes it possible to effectivelyadjust any fluctuation caused to arise in the optical output of thelight emitting element 314, since both the optical input from the lightemitting element 314 and that from the light emitting element 315c areobtained.

In the present embodiment, the optical coupling between the respectivelight emitting elements 315a-315b and the branching optical wave guides331a-331d may be achieved by any one of the various arrangements shownin FIGS. 19(a) to 19(h), in which FIG. 19(a) shows that the light fromthe element 315 is made to reflect at a mirror portion so as to beincident upon an end edge surface of the wave guide 331; FIG. 19(b)shows that the light is made to be directly incident onto the wave guide331; FIG. 19(c) shows that the light is directly incident to an endmirror portion on an inclined surface of the wave guide 331 to propagatetherethrough; FIGS. 19(d) and 19(e) show that the light is directlyincident to an end prism portion at an end surface of the wave guide 331to propagate therethrough; and FIGS. 19(f), 19(g) and 19(h) shows thatthe light is made to be incident to a condensing lens provided an theend surface of the wave guide 331.

In FIG. 19(i), there is shown a further optimum embodiment in which aplurality of discontinuous branching optical wave guides are separatedby a space, in which means for adjusting the amount of the lightpropagated through the wave guides is also disposed in the spaceprovided by the discontinunity. An optical interconnection board 312' ofthis embodiment is formed to have four branching optical wave guides331a'-331d' for dividing and propagating therethrough the lightprojected from a light emitting element 315c', and a further opticalwave guide 332a' for propagating therethrough a light input from a lightemitting element 314' for light-projection and providing this lightinput as a reference light to one 331d' of the branching optical waveguides. In this optical interconnection board 312', there is provided anaperture 328' which cuts off intermediate portions of two 331b' and331c' of the branching optical wave guides, the two being positionedtowards the middle of the four, and condensing lenses 356a' and 356b'are provided as bulging outwardly at opposite edge portions of the board312' towards the light emitting elements 314' and 315c'. Further, atpositions on a side edge of the board 312' where end edges of thebranching optical wave guides 331a' and 331b' are located and wherelight receiving elements 317', 318', 319a', 319b' and 320' of an IC chip321' are optically coupled, there are provided collimating lenses355a'-355d' which bulge outwardly. It should be appreciated that, whilethe drawing does not specifically show such features as an operationindicating wave guide, light projecting and receiving lens portions asin the foregoing embodiments, such features can be similarly provided.

Between the collimating lenses 355a'-355d' of the opticalinterconnection board 312' and the light receiving elements 318'-320' ofthe IC chip 321', there is disposed a light intensity throttling means350' such as shown in FIGS. 19(j) and 19(k), and this throttling means350' comprises a throttle plate 351' having four throttling portions351a'-351d' which are aligned with the collimating lenses 355a'-355d',and a light shielding knob 353' mounted to a housing (not shown) so asto be shiftable as rotated and having a slit 352' which can come intomatching relation as the knob is caused to shift to one or more of thethrottling portions 351a'-351d' or out of the matching relation. In thepresent instance, the slit 352' of the knob 353' may be replaced by athrough hole 352" such as in a light shielding knob 353" of FIG. 19(l).

In the optical sensor of this embodiment, too, substantially the samelight projection and reception with respect to the detection area areperformed by the light projecting means including the light emittingelement 314' as well as the light receiving means as in the foregoingembodiments, while a projected light from the light emitting element315c' is made incident through a proper mirror portion to the branchingoptical wave guides 331a'-331d' as an input light, output light from thecollimating lenses 355a'-355d' will be led through the throttling means350' to an optimum mirror portion to be thereby refracted to be incidentupon the light receiving elements 318'-320', and the same operation asin the foregoing embodiments can be realized. In the present case, alight intensity varying member is disposed in the aperture 328' forshifting operation to modulate propagated light through the twobranching optical wave guides 331b' and 331c'. For the light intensityvarying member, one such as will be described later with reference toFIG. 21 or 26 may be employed. In common to the arrangement of FIG. 16,the optical interconnection board as well as the circuit parts thereofof the present embodiment may be mounted onto the same side having theconductor pattern of the printed circuit substrate, as in the embodimentof FIGS. 17-19. This concentrated mounting on the same side is extremelyadvantageous and may be employed also in another embodiment referred toin the following with reference to FIG. 20.

In FIG. 20, still another embodiment of the optical sensor according tothe present invention shows optical coupling of branching optical waveguides 431a to 431d to corresponding wave guides 431a' to 431d' througha prism member 460, so that the light projected out of collimatinglenses 455a to 455d at end edges of the wave guides 431a to 431d will bereflected twice within the prism member 460 to be incident on condensinglenses 456a to 456d at end edges of the corresponding branching waveguides 431a' to 431d'. In this case, the sensitivity adjustment can berealized by inserting a perforated rotary disk such as shown in FIG. 8between the respective collimating lenses 455a to 455d and the prismmember 460. Other modifications and operation of this embodiment are thesame as those in the foregoing embodiments.

Referring next to FIGS. 21 to 24, there is shown another light intensityvarying arrangement employable in the optical sensor according to thepresent invention, in which a light intensity varying member 545comprises a pair of eccentric cams 557a and 557b which are secured ontoan axially rotatable shaft so as to be axially separated from each otherand extend radially from the shaft so as to have a phase difference at amechanical angle of 90 degrees, and the eccentric cams 557a and 557b aredisposed to oppose a notch 528 formed so as to partly cut off twobranching optical wave guides 531b and 531c in an opticalinterconnection board 512. A forked and elastic light shielding plate553 having respective flaps 554a, 544b extending from deflectable forkedends thereof is disposed between the member 545 and the board 512 sothat the forked ends of the light shielding plate 553 will be urged bythe eccentric cams 557a and 557b to alternately insert each of the pairof flaps 554a and 554b into the notch 528 so as to be disposed at thecut off part of the wave guide 531b or 531c. In response to the rotationof the light intensity varying member 545, therefore, the flaps 554a and554b are caused by the eccentric cams 557a and 557b to move into and outof the notch 528 and, responsive to the degree of the insertion, theamount of the light propagation in the wave guides 531b and 531c can bevaried as shown by curves in FIG. 25 in which the light intensity D inthe wave guides 531b and 531c is taken on the ordinate and the rotaryangle of the member 545 is taken on the abscissa.

In FIGS. 26 to 29, there is shown yet another light intensity varyingarrangement. In this embodiment, a light intensity varying member 645also comprises a pair of eccentric cams 657a and 657b secured to anaxially extending rotatable shaft so as to be axially separated fromeach other and extend radially from the shaft so as to have a mechanicalphase difference, a notch 628 is provided in an optical interconnectionboard 612 to partly cut off two optical wave guides 631b and 631c formedin the board 612, a forked spring plate 653 is secured above the board612 to dispose its two forked free ends between the notch 628 and theeccentric cams 657a and 657b disposed to oppose the notch 628, and apair of light shielding members 654a and 654b are supported by the freeends of the plate 653 so as to be caused by the rotated cams 657a and657b to shift into and out of the notch 628. In proper positions of thelight shielding members 654a and 654b, through holes 655a and 655b areprovided so that the through holes 655a and 655b will movereciprocatingly in the notch 628 with the shifting light shieldingmembers 654a and 654b, the light propagation through the wave guides631b and 631c being shielded by other portions of the members 654a and654b than the through holes 655a and 655b, so as to properly vary theamount of light propagated. When these light shielding members 654a and654b are disposed so as to be slidable along but intimately engage withperipheral walls of the notch 628, light is allowed to pass only throughthe holes 655a and 655b to propagate through the wave guides and, asshown in FIG. 28, the sensor can be prevented from being influenced byleakage LL of light from any other parts of the device as shown in FIG.29.

According to still another feature of the present invention, there isemployed in the light receiving means a light receiving lens whichcomprises an anamorphic lens which expands a condensed light spotprovided to a position detecting element for detecting the position in adetection area of an object in response to a reflected light therefrom,the expansion being made in a direction perpendicular with respect tothe direction of travel of the condensed light spot. Referring now toFIGS. 30 and 31, a light receiving means 702 provided as properly spacedfrom a light projecting means 700 comprises a light receiving anamorphiclens 742, while a position detecting means 721 is disposed behind thelens 742. The position detecting means 721 comprises a pair ofphotodiodes 721a and 721b, adjoining line AL which is disposed so as tobe diagonal with respect to a straight line extending in a movingdirection denoted by an arrow M of the condensed spot S of light whichhas passed through the light receiving lens 742.

In this arrangement, light is projected from the light projecting means700, and a reflected light back from an object OJ1, OJ2 or OJ3 in adetection area at a distance R₁, R₂ or R₃ from the projecting means 700is condensed as it passes through the anamorphic light receiving lens742 to form a condensed light spot S1, S2 or S3 on the positiondetecting means 721, on which each condensed spot takes a positioncorresponding to the distance of the object as seen in FIG. 30, and theposition detecting means 721 provides an output current in which theratio I_(A) /I_(B) of outputs of both photodiodes 721a and 721b variesdepending on the position of the condensed light spot. That is, thedistance of the object can be obtained on the basis of the ratio I_(A)/I_(B) of the output current. Here, the condensed light spots S1-S3 arerespectively expanded to be linear in the direction perpendicular to themoving direction M of the spot responsive to the distance of the object,as seen in FIG. 31, whereby the distribution of the intensity ofillumination by the linear condensed light spot on the detecting means721 is made substantially always constant even when the object OJ movesto traverse the detection area in a direction vertical to the plane ofFIG. 30 or, in particular, when the object is present at a positionwhich deviates from the optical axis of the light from the lightprojecting means 700 vertically with respect to the plane of thedrawing, as will be seen in FIGS. 32(a) to 32(c), as well as in FIGS.33(a) to 33(c). In other words, the detection of the object traversingthe optical axis in a vertical direction with respect to the plane ofthe drawing results in variation in the intensity of illumination LUsuch as in curves of FIG. 33 but in such constant illuminationdistribution, so that the ratio I_(A) /I_(B) of detected positionsignals I_(A) and I_(B) provided by the photodiodes 721a and 721b willnot vary and accurate position and distance signals can be alwaysobtained.

It is also advantageous to employ position detecting means 821, 821a and821b such as shown in FIGS. 34 to 36, in which the means comprise threeor more of the photodiodes adjoined. When, for example, the positiondetecting means 821 comprises three photodiodes as in FIG. 34 and thecondensed light spot S is provided closer to a longitudinal end of themeans 821 as in FIG. 37, the distribution of illumination LU of thelinear condensed light spot is made by the anamorphic lens to besubstantially constant over the entire detecting means 821 but is unableto be made completely constant. Provided that the object OJ in thedetection area moves to traverse the optical axis in the verticaldirection with respect to the plane of the drawings, the level ofillumination LU will be as shown in FIGS. 38(a) to 38(c) in which, inparticular, the state shown in FIG. 38(a) shows that the output of onlythe left side end photodiode rises to be higher so as not to be able toobtain accurate I_(A) /I_(B) information. In this case, as shown inFIGS. 34 to 36 in which plurality of sharply angled triangularphotodiodes are interengaged with each other in the longitudinaldirection of the means 821, 821a and 821b, i.e., in the moving directionM of the condensed light spot, because the photodiodes in each means areso arranged that one output signal I_(A) is obtained from a group ofphotodiodes including ones which are disposed on both widthwise sideswhile the other output signal I_(B) is obtained from the otherphotodiode or the other group of photodiodes disposed inwardly thereof,it is made possible that the distance signal I_(A) /I_(B) of an objectwhich moves in the direction transverse to the optical axis in thedetection area becomes larger than a value accurately corresponding toan actual distance R. That is, the output of the position detectingmeans 821 is discriminated at a signal processing means to correspond toa distance larger than the actual distance. However, it is possible toreliably prevent from occurring any erroneous operation that may occurupon an uneven signal generation such as in FIG. 38(a) with respect toan object which only starts moving to traverse the detection area ratherthan moves in a direction of approaching the light receiving means.Furthermore, in operating the position detection, it will be possible toemploy an operating means such as has been disclosed in U.S. Pat. No.4,633,077 (or German Pat. No. 3,407,210 or Italian Patent ApplicationNo. 47757-A/84) of an earlier invention of the same assignee as in thepresent case.

FIG. 39 shows another optical sensor in which a light receiving means902 comprises an anamorphic light receiving lens 942, a positiondetecting means 921 and a prism 960 disposed between the lens 942 andthe means 921 so as to be shiftable along the means 921 for adjustingthe set distance of the detection area. With this arrangement, theposition of the condensed light spot on the position detecting means canbe varied and, in combination with the same type of the positiondetecting means as in the above, a similar erroneous operation can beeffectively prevented. With the arrangement, further, it is possible toremarkably simplify the required arrangement for setting the detectionarea, to achieve improvements in the ease of assembling andmass-producibility, and to elevate the reliability with reducedpossibility of erroneous operation.

While the present invention has been explained with reference to theforegoing embodiments shown in the accompanying drawings, it should beappreciated that the invention is not limited to only these embodimentsshown but rather, includes all modifications, alterations and equivalentarrangements possible within the scope of appended claims.

What we claim as our invention is:
 1. An optical sensor comprising meansfor projecting light to a detection area, means for receiving lightreflected from an object present in said detection area, a sensorfunction setting means capable of energizing said light projectingmeans, a signal processing means for processing output signals from saidlight receiving means to discriminate the presence of said object andfor providing an object detection signal, and an optical interconnectionboard including optical wave guides respectively interconnecting saidlight projecting means, said light receiving means, said sensor functionsetting means and said signal processing means with one another.
 2. Anoptical sensor according to claim 1, which further comprises a printedcircuit substrate, said light projecting means, said light receivingmeans, said sensor function setting means, said signal processing meansand said optical interconnection board being disposed on a surface ofone side of said substrate.
 3. An optical sensor according to claim 1,which further comprises a printed circuit substrate, and wherein saidlight projecting means comprises a light emitting element and a lightprojecting lens portion, and said light receiving means comprises alight receiving element and a light receiving lens portion, said lightemitting and receiving elements as well as said sensor function settingmeans being disposed on one surface side of said substrate while saidlight projecting and receiving lens portions as well as said opticalinterconnection board being disposed on the other surface side of saidsubstrate.
 4. An optical sensor according to claim 3, wherein saidprinted circuit substrate is provided with through holes for saidoptical interconnection between respective said light emitting andreceiving elements and sensor function setting means on one side of thesubstrate and said light projecting and receiving lens portions andoptical interconnection board on an opposite side of the substrate. 5.An optical sensor according to claim 3, wherein said printed circuitsubstrate is made of a transparent material.
 6. An optical sensoraccording to claim 1, wherein said light projecting means includes alight emitting means, said optical wave guides include branching opticalwave guides for propagating therethrough light from said lightprojecting means, a sensor operation indicating optical wave guide forindicating operation of said optical sensor, an optical wave guide forproviding a reference level of light, and means provided in associationwith said branching optical wave guides for varying the amount of lightpropagated in a part of the branching optical wave guides.
 7. An opticalsensor according to claim 6, wherein said optical interconnection boardfurther includes mirror portions for reflecting light so as to beincident onto said optical wave guides.
 8. An optical sensor accordingto claim 6, wherein said optical interconnection board is furtherprovided with a light projecting lens forming part of said lightprojecting means, and with a light receiving lens forming part of saidlight receiving means, said light projecting lens and said lightreceiving lens being formed integral with the optical interconnectionboard.
 9. An optical sensor according to claim 6, wherein said opticalinterconnection board is further provided with a mode changing meansprovided in association with another part of said branching optical waveguides, and with an indicator means disposed so as to receive lightpassing through said sensor operation indicating wave guide.
 10. Anoptical sensor comprising means for projecting light, means forreceiving light, a sensor function setting means capable of energizingsaid light projecting means, a signal processing means for processingoutput signals from said light receiving means for providing a detectionsignal, an optical interconnection board including optical wave guidesrespectively interconnecting said light projecting means, said lightreceiving means, said sensor function setting means and said signalprocessing means with one another and a printed circuit substrate, saidlight projecting means, said light receiving means, said sensor functionsetting means, said signal processing means and said opticalinterconnection board being disposed on said substrate.
 11. An opticalsensor according to claim 10, wherein said printed circuit substrate,said light projecting means, said light receiving means, said sensorfunction setting means, said signal processing means and said opticalinterconnection board are disposed on a surface of one side of saidsubstrate.
 12. An optical sensor according to claim 10, which furthercomprises a printed circuit substrate, and wherein said light projectingmeans comprises a light emitting element and a light projecting lensportion, and said light receiving means comprises a light receivingelement and a light receiving lens portion, said light emitting andreceiving elements as well as said sensor function setting means beingdisposed on one surface side of said substrate while said lightprojecting and receiving lens portions as well as said opticalinterconnection board being disposed on the other surface side of saidsubstrate.
 13. An optical sensor according to claim 12, wherein saidprinted circuit substrate is provided with through holes for saidoptical interconnection between respective said light emitting andreceiving elements and sensor function setting means on one side of thesubstrate and said light projecting and receiving lens portions andoptical interconnection board on an opposite side of the substrate. 14.An optical sensor according to claim 12, wherein said printed circuitsubstrate is made of a transparent material.
 15. An optical sensoraccording to claim 10, wherein said light projecting means includes alight emitting means, said optical wave guides include branching opticalwave guides for propagating therethrough light from said lightprojecting means, a sensor operation indicating optical wave guide forindicating operation of said optical sensor, an optical wave guide forproviding a reference level of light, and means provided in associationwith said branching optical wave guides for varying the amount of lightpropagated in a part of the branching optical wave guides.
 16. Anoptical sensor according to claim 15, wherein said opticalinterconnection board further includes mirror portions for reflectinglight so as to be incident onto said optical wave guides.
 17. An opticalsensor according to claim 15, wherein said optical interconnection boardis further provided with a light projecting lens forming part of saidlight projecting means, and with a light receiving lens forming part ofsaid light receiving means, said light projecting lens and said lightreceiving lens being formed integral with the optical interconnectionboard.
 18. An optical sensor according to claim 15, wherein said opticalinterconnection board is further provided with a mode changing meansprovided in association with another part of said branching optical waveguides, and with an indicator means disposed so as to receive lightpassing through said sensor operation indicating wave guide.